Check list:
It's not that we've gotten lazy, not even close! In fact we're far more productive now than we've ever been. But with more and more work to do, we need your help. We have created a check list to help prevent delays.

• Aperture list
• Excellon Drill File
• Tool List
• Gerber Files
• Sufficient annular ring
• Sufficient line Width/Spacing
• Sufficient Inner Clearances

Net List:
Sometimes our brains need a break and we turn to technology to find our mistakes. We 100% EVERY part number a net list comparison extracted from your Gerber data to ensure your designs accuracy. Admit it – despite your high IQ even you have been known of making some of these most common mistakes…

• Isolated thermals
• Un-routed connections
• Split planes

DRC & DFM:
Design rule checks and design for manufacturbility are KING. Our CAM software will find ways to improve your yields, productivity and quality. Yeah, so you can rest easy.

Stack Up:
You treat your design like your baby. And you want it to have the perfect combination of technology, practicality, materials, and quality stackup. Here’s some parental advice…

• Design an even number of layers for balance
• Balance your Power and ground layers with the center of your board
• Uneven copper distribution on interior layers can cause warp
• Balance your copper layers from the centerline of your board
• Design with a consistent dielectric thickness from your centerline

But your not in this alone! We review your designs for reliable and cost effective stack up.

Controlled Impedance:
Want to add more excitement to your life? Add controlled impedance to your board and discover the true thrill of controlling signal switching speeds. And if you don’t know how, we can help!

• Differential Impedance PCB Structure
• Single Ended Impedance
• Microstrip and Stripline Constructions
• Boundary Element Method (BEM)

We simulate and verify your design. And measure your soldermask thickness between and adjacent to tracks.

Via in Pad:
You dream, and hey, we won't stop you! Via in pad is tricky but we know you engineers like to show off. But we have just a few words of advice…

• Design vias in between the pads
• Include in your design notes that vias should be plugged, tinted, capped or microvia drilled so that it does not go all the way through the board.
• Never design open vias on a pad
• BGA does not work well with a capped process

We are actively involved in industry organizations that are specific to our technology. For more helpful tips, just visit theses sites: